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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
Notice
c CERAFIL r 4.5-6.5MHz Chip Type SFSKA Series
o Soldering and Mounting
1. Standard Reflow Soldering Conditions
(1) Reflow
P50E.pdf
Sep.19,2012
Filter is soldered twice within the following temperature
conditions.
260
Peak
(260°C max.)
230
Heating
Pre-heating
(230°C)
100
(150-180°C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron
Filter is soldered at +350±5°C for 3.0±0.5 seconds. The
soldering iron should not touch the filter while soldering.
(3) Conditions for Placement Machines
The component is recommended for use with placement
machines that employ optical placement capabilities.
Damage may result from excessive mechanical force.
Please make sure that you have evaluated by using
placement machines before going into mass production.
Do not use placement machines that utilize mechanical
positioning. Please contact Murata for details beforehand.
(4) Other
(a) The component may be damaged if excess
mechanical stress is applied to it mounted on the
printed circuit board.
(b) Design layout of components on the PC board to
minimize the stress imposed on the warp or flexure of
the board.
(c) After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause
[Component Direction]
[Component Layout Close to Board]
Put the
component
lateral to the
direction in
which stress
acts.
destruction resistance characteristics to degrade. To
prevent this, be extremely careful in determining
shape and dimension before designing the circuit
board diagram.
Perforation
A
B
Slit
C
Susceptibility to
stress is in the order
of : A>C>B
(d) When the positioning claws and pick-up nozzle are
worn, the load is applied to the components while
positioning is concentrated to one positioning
accuracy, etc. Careful checking and maintenance are
necessary to prevent unexpected trouble.
(e) When correcting chips with a soldering iron, the tip of
the soldering iron should not directly touch the chip
component.
2. Wash
Do not clean or wash the component as it is not
hermetically sealed.
Continued on the following page.
58
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